Cleaving and Sawing are processes by which a diamond can be divided into 2 pieces. Diamond structure constitutes of different planes. If the marking is along with or parallel to its planes then the diamond has to be cleaved. Cleaving is simply done by a chisel and hammer, wherein the hardest material available is split into 2 pieces at the blow of the hammer. Sometime blade sawing method is also use to cleave the stone.

If the marking is perpendicular or against the planes then the diamond needs to be laser sawn.